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Application |
Factor to be monitored |
SDI technology |
Issue |
|
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Cu CMP | Cu cross-contamination / barrier layer integrity | SPV, MC | GOI |
| Low K dielectrics | Capacitance: K | SPV/Fe | Switching speed | |
| Leakage | SASS | Switching speed | ||
| Mobile Ion Mapping Mobile Ion Identification | MC ID Spectrometer | Reliability | ||
|
Plasma Damage:
Thin film deposition
Etching / Ashing
|
Heavy metal contamination | PDM, SILC, COCOS | GOI | |
| Mobile Ion contamination | MC | Reliability | ||
| Oxide charge | SILC, BDF | ILD Integrity | ||
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