The Plasma Damage Monitor (PDM) provides a non-contact,
real-time technique for monitoring of plasma charging,
without the need to build costly and time consuming test
structures. Correlation to traditional techniques has been
established in numerous tests / locations for charging
damage due to antenna effect. Additionally, secondary
damage such as UV radiation damage may also be assessed by
measuring additional parameters - such as Dit and
dielectric leakage.
The FAaST series of PDM tools provide:
- FastMaps of plasma charging – Residual charge left on the
surface of a dielectric after plasma processing can be
imaged, with >6000 points measured in ~3 minutes.
- Trapped and interface charges induced by plasma
processing, using COCOS measurement technology.
- Dielectric film quality and radiation induced damage is
measured using SASS I-V, SILC, and Soft Breakdown Field.
- Fully automated operation, with multiple security levels
designed for the manufacturing environment.
- Options such as SMIF / FOUP loadports, automatic lot ID,
wafer OCR, and fully SEMI compliant automation for data
upload and remote system control.
- Automatic internal calibration.
The FAaST 200 series can be configured for multiple wafer
sizes from 100mm to 200mm, and FAaST 300 series for
200mm-300mm wafers. Stand alone PDM systems are available
for routine monitoring of residual plasma charge, or PDM
tools can be combined with SDI’s other technologies, such
COCOS / CV / or SL, to minimize footprint, and provide
complimentary measurements for more complete plasma tool
characterization.
The Plasma Damage Monitor
(PDM)
